VT-X700-E / -L

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VT-X700-E / -L

High-speed automated X-ray CT inspection system

The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality!


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VT-X700-E / -L Features 1
VT-X700-E / -L Features 2

Pinpoint Inspection

3D-CT Method

The cross-sectional images of relevant inspection targets can be easily ed from abundant camera-image libraries to ensure precise fault detection.

VT-X700-E / -L Features 4

Full coverage

High-Output X-Ray Source

Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source.

VT-X700-E / -L Features 6

Compatibility with L-Sized (610 mm × 610 mm) PCBs

Compatible with large-sized PCBs such as those used by network base stations.


10% Reduction in Inspection Tact Time (Internal Comparison)

World's highest CT speed* thanks to our patent-approved technologies.
New imaging system reduced inspection tact times by 10% compared with conventional systems.
Enabled the complete inspection of all components
(almost impossible by visible light-based inspection).
* Based on an internal research conducted in January 2015.


DIC, short for Dynamite International Corporation, established in 1994, has been mainly engaging in production equipment sales, technical service and manufacturing process support.

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