The cross-sectional images of relevant inspection targets can be easily ed from abundant camera-image libraries to ensure precise fault detection.
The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality!
CONTACTThe cross-sectional images of relevant inspection targets can be easily ed from abundant camera-image libraries to ensure precise fault detection.
Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source.
Compatible with large-sized PCBs such as those used by network base stations.
World's highest CT speed* thanks to our patent-approved technologies.
New imaging system reduced inspection tact times by 10% compared with conventional systems.
Enabled the complete inspection of all components
(almost impossible by visible light-based inspection).
* Based on an internal research conducted in January 2015.