The phoenix microme|x is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI). Inn
Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
Combined 2D / 3D CT operation
KEY FEATURES
180 kV / 20 W high-power microfocus tube with up to 0,5 µm detail detectability
Brilliant live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
Precise manipulation
3D computed tomography scans within 10 seconds (optional)
Advanced planarCT option for slice or multislice package evaluation without overaying structures