Xceed – New Generation 3D AOI

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Xceed – New Generation 3D AOI

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High Accuracy & High Speed

3D AOI Sensor Head (TRSC-I)

3D AOI Sensor Head
  • High Speed CMOS Camera (4Mega-pixel) with Dual Laser Technology
  • RGB LED Lights
  • Telecentric Lens
  • Light Weight, Compact Sensor Head Design
  • Industry Leading Inspection Speed: 65 cm2/sec @ 14 x 14um
  • Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload
3D AOI Sensor Head (TRSC-I)

3D AOI

  • True 3D measurement provides the most accurate and repeatable inspection results with the minimum false calls.
3D AOI Xceed

Smart Inspection

  • Dark PCB
  • White PCB
 
  • Ceramic PCB
  • Reflective Components
 

Real 3D Image

  • Advanced Signal Processing results in noise-less, clear and accurate 3D images.
Real 3D Image

Easy Software

Common, Simple User Interface

  • PARMI’s exclusive, uniform and common user interface for both the SPI and AOI systems make it easy to learn and use for both new and existing SPI customers.
 

Programming Ease

  • One-Click teaching provides automatic ROI creation for most common inspection settings.
  • Includes 7 fundamental inspection items: Missing, Lift, Size, Misalignment, Side-mount, Tombstone, Upside-down.
 

Barcode & Bad Mark Recognition

  • In one inspection, both Barcode and Bad Mark are recognized simultaneously. 1D, 2D, QR Laser Marking, and Printing barcodes are recognizable.
 

Detect All Defect Types

Detect all defect types in smt

ABOUT

DIC, short for Dynamite International Corporation, established in 1994, has been mainly engaging in production equipment sales, technical service and manufacturing process support.

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