AirVac ONYX29

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AirVac ONYX29

High Performance Automation Rework

Robotic SMT Production, Rework & Assembly
Lead-Free Requirements
Seven Axes of High Automation
Multiple Field of View (MFOV)
Automated Precision Component Pick-Up

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主要优点:
•9微米贴装精度(0.0003“)@ 3 Sigma
•大量返工
•超快速加热以实现无铅返工
快速,受控的电路板冷却
•过程可重复性
•关节温度均匀
•精确的空气流量
•简单,快速和易于使用的软件
•用于组件对齐的大而清晰的图像
•高达3.0“(75mm)
•微型场地清洁
•清洁和均匀垫更换设备
•将点或线焊接到0.010“
•分配焊膏,环氧树脂,填料或焊剂“

 

 

0201 Removal
0201 Removal Video Clip
(See Micro Component Rework Kits)

   
  特点与优势:
无铅要求
•强大的2000瓦顶部加热器。
红外(IR)底部加热技术。加热元件在整个表面上提供非常均匀的预热。底部加热面板是19“×19”,并具有四个(4)独立可编程加热区(6000瓦)。
•可编程的冷空气喷射和线性气刀提供精确的冷却控制,优化回流焊时间。
•交互式温度曲线分析提供“即时”调整。
高自动化七轴
•控制X,Y,Z,Theta,视觉变焦,视觉X和视觉Y.

多视野(MFOV)
•自动将相机索引至最大75mm的大型组件的四角。
自动精密部件拾取
•从大,小华夫饼托盘,凝胶包装,磁带和卷轴,以及单组件嵌套的多位置拣选功能。
•精密微力传感提供了拾取微小,脆弱设备所需的非常低的力量。
点胶技术
•新兴技术的返修和小批量组装通常需要集成精密分配锡膏,助焊剂,环氧树脂或底部填充料。

 

     

 

专有的非接触式现场清洁
•带有内径为0.063“的高温,非研磨性复合真空微型吸头的新型微型吸头现场清洁组件(#1015.11.059)。
•具有自动高度调整功能的复合真空吸头,可自动补偿可变的剩余焊料量。
•消除由接触式方法导致的对焊盘或阻焊层的潜在损坏。
•对于回流温度较高的无铅焊料的去除以及微小的易碎焊盘/阻焊层的微观部位清洁尤为重要。可编程的微型焊嘴可以在不影响相邻器件的情况下从小型焊点中移除焊料
•强大的加热和真空,加上高效率的底部加热,也可以去除通孔和Mictor连接器桶中的焊料。
•导电加热/真空吸头可以去除0201和其他无法使用对流场地清洁的垫片。
Visual MachinesTM软件
•图形用户界面向操作员提供了电路板和组件位置的直观表示。一个或多个部件位置可以在一个周期内重新工作。
•扩展组件库包括现成的工艺流程和热参数
锡/铅和无铅组件。

 

   
   

OPTIONS

Pivoting IR Probe with Laser Pointer #0029.11.041

• Provides process repeatability by insuring that the board is at the exact same target temperature each time before localized reflow begins.
• Operator is instructed to position the sensor at the beginning of the process.
• Laser point provides a visual reference to the center of the IR sensor verifying position over the substrate at the same location as profiled.
• Pivot function allows positioning on small boards without interference of the nozzle heating throughout the rework processes.
• Non-contact temperature sensor monitors topside board temp and triggers localized reflow process once the target temperature is reached.

High Throughput Carousel Fixture for Small Board Rework #0029.15.041
• Rework capacity and process control for small boards can be substantially increased by the addition of the four-zone, high throughput carousel fixture.

 

     

 

Automatic Tool Changer with Component Pick, Prep & Drop
• ProvidesaAdditionalaAutomation &pProcesscControl
• Eliminates manual handling of hot nozzles
• Provides permanent locations & easy access for:
- Single component or multi-component pick stations
- Component dip stations (tacky flux or new dippable solder paste)
- Component drop off station
• Micro-force controlled component pick & prep
• Industrial grade steel design (each pocket arm weighs 14 lbs)
• Five pocket (#0029.14.010) or ten pocket system (#0029.14.011)

 

   
  Site Cleaning System #0029.03.012
• Includes Standard and Micro nozzles.
• High temperature composite vacuum tip eliminates metal-to-metal contact.
• Vacuum sensor automatically and continuously adjusts tip height, providing non-contact site cleaning.
• Various size heating noses and tips to clean virtually any site.
• Ready-to-use site cleaning programs for fully automated solder removal.
   
  Micro Component Rework & Site Cleaning Kits
Precision Rework in Four Simple Steps!
• Removal, Site Clean, Apply Solder Paste, and Component Replacement
• Kits available for various Ultra Micro and Micro Components

• Component specific Micro Tips for precision process operations
 

 

 

  Component Shuttle #0029.02.042
• Provides a safe, repeatable location for component pick up, flux dipping and drop off away from the heated work area.
• Eliminates manual component loading/removal in the heated work area.
• Software-controlled pneumatic shuttle enters the work area for pick up, flux dipping or drop off, then exits the work area.
• Shuttle-based component pick up and flux dipping is set and monitored with machine force placement system.
• Multi-location pick and flux dipping capability for multi-processing of small devices (custom tooling required).
   
         
  Direct View Camera with 20" Video Monitor #0029.04.041
• Provides high magnification site viewing including the ability to verify when component reflow has occurred.
• Operator is instructed to position the camera on the site. Focus, zoom, and lighting adjustments are made to optimize clarity. The image is displayed on a flat screen monitor.
• A process development aid especially for difficult to see tiny solder joints.
• Recommended for use in conjunction with the automatic site cleaning system to verify cleaning on dense assemblies and for the dispensing option to provide dispense inspection capability.
   
         
  Dispensing System #0029.08.010
• Provides on-machine dispensing of flux, solder paste, adhesive, epoxy or underfill.
• Proprietary time/pressure dispenser features automatic pressure compensation and programmable vacuum adjustment for accurate and repeatable results.
• Uses precision DL Technology dispense needles.
• Automatic pattern generation software to easily create dispensing patterns
• Note: dispensing requires ambient machine/ assembly temperature. Nozzle cool air injection and the board cooling system can be simultaneously activated to prepare the machine and assembly for dispensing, however this in not practical from a time standpoint for each individual rework process.
• The on-machine dispense option is typically used in either a batch mode or for low volume, specialty applications.
   
         
  Dipping Kit for Solder Paste or Flux #FASET1
• Superior to applying paste via component or board stencils
• Easier process, less operator involvement than stencils (consistent results)
• No component or board/pad coplanarity preparation issues
• No adjacent interference issues
• Excellent for extremely fine pitch, sphere or leaded size components
• One set of dipping pedestals replaces dozens of custom component stencils
   
         
  Ergonomic Workstation with CPU Holder #1003.05.010
Monitor Stand Option for Workstation #1003.05.005
Nozzle Stand Option for Workstation #1003.05.006
Locking Drawer Option for Workstation #1003.05.007

• Workstaton provides a self contained work cell environment for the machine and operator. Dimensions are 60"W X 36"D. Very sturdy construction with anti-static laminate surface. (Workstation includes CPU holder, everything else is an add on option).
   
         
  Universal Insertion Tool #AU6LGA47R
• Mechanically self-centers any device for accurate pick-up. Used in conjunction with the automatic component shuttle.
   
         
 
70mm (2.75") Topside Clearance #0029.01.052(standard is 30mm)
• Provides increased top side clearance for assemblies with vertical daughter cards or tall devices that exceed the standard 30mm (1.2”) top side clearance.

Fume Extraction Manifold #300.00.547
• Removes flux vapors for operator health and safety.
• Includes fume extraction manifold and hose assembly.
• Requires connection to a central exhaust or self-contained filtering system.


Four Additional Thermocouple Ports #300.00.504

Thermocouple Organizer #0024.90.047
     
 

公司简介

帝仕高国际有限公司(Dynamite International Corp.)简称DIC,成立于公元1994年,以经营电子产业设备之销售,技术服务与制程支持为基础,进而提供客户专业专精之生产设备及完整的产线规划之公司。

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