ONYX29

KEY BENEFITS:
• 9 micron placement accuracy (0.0003”) @ 3 Sigma
• High volume rework
• Ultra-fast heat up for Lead-Free Rework
• Fast, controlled board cool down
• Process repeatability
• Uniform joint temperature
• Precision air flow
• Simple, fast & easy to use software
• Large, clear images for component alignment
• Components up to 3.0” (75mm)
• Micro site cleaning
• Clean and uniform pads for replacement device
• Solder dots or lines down to 0.010”
• Dispensing of solder paste, epoxy, under fill or flux"

0201 Removal Video Clip
(See Micro Component Rework Kits)

FEATURES/BENEFITS:

Lead-Free Requirements
• Powerful 2000 watt top heater.
• Infra-red (IR) bottom heating technology. The heating element provides extremely uniform preheat over the entire surface. The bottom heating panel is 19" x 19" and features four (4) independently programmable heating zones (6000 watts).
• Programmable cold air injection and linear air knife provide precise cool down control to optimize time over reflow.
• Interactive thermal profiling provides "on-the-fly" adjustments.

Seven Axes of High Automation
• Control of X, Y, Z, Theta, Vision Zoom, Vision X & Vision Y.

Multiple Field of View (MFOV)
• Automatically indexes the camera to the four corners of large components up to 75mm.

Automated Precision Component Pick-Up
• Multi-position pick capability from large and small waffle trays, gel packs, tape and reel, and single component nest.
• Precision Micro-Force sensing provides the extremely low force needed to pick tiny, fragile devices.

Dispensing Technology
• Rework and low volume assembly of emerging technology typically requires integrated precision dispensing of solder paste, flux, epoxy or underfill.

Proprietary Non-Contact Site Cleaning
• NEW Micro Tip Site Clean Assembly (#1015.11.059) with a high temp, non-abrasive, composite vacuum micro tip with an inside diameter of 0.063".
• Composite vacuum tip with automatic height adjustment, automatically compensates for variable residual solder volume.
• Eliminates potential damage to pads or solder mask caused by contact-based methods.
• Especially critical for removal of Lead-Free solder with higher reflow temperature and for micro site cleaning of small, fragile pads/solder mask. Programmable micro tips remove solder from small sites without affecting adjacent devices.
• Powerful heat and vacuum, combined with high efficiency bottom heating, can also remove solder from barrels of through hole and Mictor connectors.
• Conductive heating/vacuum tips remove solder from 0201 and other pads where convective site cleaning can not be used.

Visual MachinesTM Software
• Graphical user interface provides a visual representation of the board and component locations to the operator. One or multiple component sites can be reworked during a single cycle.
• Expanding component library includes ready-made process sequences and thermal parameters for
Tin/Lead and Lead-Free components.

OPTIONS

Pivoting IR Probe with Laser Pointer #0029.11.041
• Provides process repeatability by insuring that the board is at the exact same target temperature each time before localized reflow begins.
• Operator is instructed to position the sensor at the beginning of the process.
• Laser point provides a visual reference to the center of the IR sensor verifying position over the substrate at the same location as profiled.
• Pivot function allows positioning on small boards without interference of the nozzle heating throughout the rework processes.
• Non-contact temperature sensor monitors topside board temp and triggers localized reflow process once the target temperature is reached.

High Throughput Carousel Fixture for Small Board Rework #0029.15.041
• Rework capacity and process control for small boards can be substantially increased by the addition of the four-zone, high throughput carousel fixture.

Automatic Tool Changer with Component Pick, Prep & Drop
• ProvidesaAdditionalaAutomation &pProcesscControl
• Eliminates manual handling of hot nozzles
• Provides permanent locations & easy access for:
- Single component or multi-component pick stations
- Component dip stations (tacky flux or new dippable solder paste)
- Component drop off station
• Micro-force controlled component pick & prep
• Industrial grade steel design (each pocket arm weighs 14 lbs)
• Five pocket (#0029.14.010) or ten pocket system (#0029.14.011)