Improve Performance, Optimize Production, Improve Quality, Reduce Costs and Increase Customer's Revenues
Total solution: Solder Paste Printing/Inspection, Reflow Soldering/Selective Soldering, 3D Optical Inspection, X-Ray and CT (Computerized Tomography), Rework for BGA, AGV(Automatic Guided Vehicle).....
Best choice for the latter part of the packaging process: Application of X-Ray and CT to package inspection (SOP, LCC, QFP, BGA, PGA) and AGV in clean room - Smart transportation
X-RAY & AXI: To assist Automobile Electronics Factory to fully meet the requirements of ISO/TS 16949
Smart monitoring system for realizing industry 4.0: Integration of big data in cloud, manufacturing equipment and shop floor with management personnel to improve production efficiency.